DocumentCode
564793
Title
Microelectronic technology on paper substrate
Author
Balde, Mamadou ; Jacquemoud-Collet, Fanny ; Charlot, Benoit ; Combette, Philippe ; Sorli, Brice
Author_Institution
Inst. d´´Electron. du Sud, Univ. Montpellier II, Montpellier, France
fYear
2012
fDate
25-27 April 2012
Firstpage
140
Lastpage
143
Abstract
The interest to develop low cost passive sensors on objects of various forms led us to adapt technological processes of microelectronics on flexible substrate. Passive components deposited on polymer flexible support such as type PET (Polyethylene Terephthalate) or Kapton® (Polyimide) are already well-known for example in Radio-Frequency Identification (RFID), strain gauge, humidity sensor, etc. The use of a very economic and ecological substrate such as paper proves much more interesting and still very little explored. However, the brittleness of this material due to moisture and temperature of use constitutes a major technical challenge taking into consideration its potential application in electronics. To use this type of substrate, we set up different processes allowing the packaging of the substrate to be able to undergo all techniques in microelectronic. This has allowed us afterward to realize various devices like inductive coils, RFID tags or interdigital capacitors, using the microelectronic manufacturing processes. We have reached excellent resolutions without any damage.
Keywords
humidity sensors; integrated circuit packaging; radiofrequency identification; strain gauges; substrates; Kapton; RFID tags; ecological substrate; economic substrate; flexible substrate; humidity sensor; inductive coils; interdigital capacitors; low cost passive sensors; microelectronic manufacturing processes; microelectronic technology; paper substrate; passive components; polyethylene terephthalate; polyimide; polymer flexible support; radiofrequency identification; strain gauge; type PET; Biological system modeling; Coils; Copper; Equations; Radio frequency; Radiofrequency identification; Thickness measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2012 Symposium on
Conference_Location
Cannes
Print_ISBN
978-1-4673-0785-7
Type
conf
Filename
6235335
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