Design and optimization of high current intelligent waveform power supply for electroplating

In this paper, a 200kW high power intelligent waveform electroplating power supply with an improved circuit topology is described. In order to realize the expansion of output power and high efficiency with intelligent output, the modular design and optimization of the structure is taken into consideration. A topology, which consists of a ZVS phase-shifted full bridge circuit and a full-bridge inverter, is proposed. To realize the high frequency of intelligent waveform, a power snubber circuit is developed. In addition, a novel MOSFET full-bridge inverter module is designed to reduce the power loss, and detailed thermal simulation to verify its improved thermal performance is also realized. Finally, an independent digital control system is fully applied to each power unit to realize the waveform control and better performance of current sharing between units.