Title :
Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding
Author :
Phommahaxay, Alain ; Jourdain, Anne ; Verbinnen, Greet ; Woitke, Tobias ; Bisson, Peter ; Gabriel, Markus ; Spiess, Walter ; Guerrero, Alice ; McCutcheon, Jeremy ; Puligadda, Rama ; Bex, Pieter ; Van den Eede, Axel ; Swinnen, Bart ; Beyer, Gerald ; Miller
Author_Institution :
IMEC, Leuven, Belgium
fDate :
Jan. 31 2012-Feb. 2 2012
Abstract :
Among the technological developments pushed by the emergence of 3D Stacked IC technologies, temporary wafer bonding and thinning have become key elements in device processing over the past years. While these elements are now mature enough for high-volume manufacturing, thin wafer debonding and handling still remain challenging. Hence this work focuses on a novel ZoneBOND approach to face these challenges.
Keywords :
integrated circuit manufacture; three-dimensional integrated circuits; wafer bonding; 3D stacked IC manufacturing; 3D stacked IC technology; ZoneBON temporary bonding process; high-volume manufacturing; room temperature peel debonding; temperature 293 K to 298 K; temporary wafer bonding; ultrathin wafer handling; Adhesives; CMOS integrated circuits; Substrates; Wafer bonding;
Conference_Titel :
3D Systems Integration Conference (3DIC), 2011 IEEE International
Conference_Location :
Osaka
Print_ISBN :
978-1-4673-2189-1
DOI :
10.1109/3DIC.2012.6262943
