Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding

Author

Phommahaxay, Alain ; Jourdain, Anne ; Verbinnen, Greet ; Woitke, Tobias ; Bisson, Peter ; Gabriel, Markus ; Spiess, Walter ; Guerrero, Alice ; McCutcheon, Jeremy ; Puligadda, Rama ; Bex, Pieter ; Van den Eede, Axel ; Swinnen, Bart ; Beyer, Gerald ; Miller

Author_Institution

IMEC, Leuven, Belgium

fYear

2012

fDate

Jan. 31 2012-Feb. 2 2012

Firstpage

1

Lastpage

4

Abstract

Among the technological developments pushed by the emergence of 3D Stacked IC technologies, temporary wafer bonding and thinning have become key elements in device processing over the past years. While these elements are now mature enough for high-volume manufacturing, thin wafer debonding and handling still remain challenging. Hence this work focuses on a novel ZoneBOND approach to face these challenges.

Keywords

integrated circuit manufacture; three-dimensional integrated circuits; wafer bonding; 3D stacked IC manufacturing; 3D stacked IC technology; ZoneBON temporary bonding process; high-volume manufacturing; room temperature peel debonding; temperature 293 K to 298 K; temporary wafer bonding; ultrathin wafer handling; Adhesives; CMOS integrated circuits; Substrates; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

3D Systems Integration Conference (3DIC), 2011 IEEE International

Conference_Location

Osaka

Print_ISBN

978-1-4673-2189-1

Type

conf

DOI

10.1109/3DIC.2012.6262943

Filename

6262943