Title :
Cu-based bonding technology for 3D integration applications
Author :
Chen, K.N. ; Xu, Z. ; Liu, F. ; Ko, C.T. ; Cheng, C.A. ; Huang, W.C. ; Lin, H.L. ; Cabral, C. ; Hsiao, Z.C. ; Klymko, N. ; Fu, H.C. ; Chen, Y.H. ; Lu, J.Q. ; Lo, W.C.
Author_Institution :
Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
fDate :
Jan. 31 2012-Feb. 2 2012
Abstract :
This paper summarizes and reports systematical studies of Cu-based bonding technology for 3D IC applications. Hybrid Cu-oxide and Cu-polymer bonding designs and schemes are investigated. Electrical performances and reliability of Cu bond structures provide important guidelines for future 3D IC applications.
Keywords :
copper; integrated circuit bonding; three-dimensional integrated circuits; 3D IC applications; 3D integration applications; Cu; copper bond structure reliability; copper-based bonding technology; electrical performances; polymer bonding designs; Bonding; Capacitance; Electrical resistance measurement; Inductance; Integrated circuits; Plastics; Reliability;
Conference_Titel :
3D Systems Integration Conference (3DIC), 2011 IEEE International
Conference_Location :
Osaka
Print_ISBN :
978-1-4673-2189-1
DOI :
10.1109/3DIC.2012.6262974
