Title :
Advances of 3M™ wafer support system
Author :
Saito, Kazuta ; Webb, Richard J. ; Dronen, Blake R.
Author_Institution :
Sumitomo 3M Ltd., Sagamihara, Japan
fDate :
Jan. 31 2012-Feb. 2 2012
Abstract :
This paper will provide a summary of the recent advances of 3M´s WSS temporary bonding systems in both process tools and adhesive.
Keywords :
adhesives; wafer bonding; 3M wafer support system; WSS temporary bonding systems; adhesive; process tools; Bonding; Force; Glass; Surface topography; Surface treatment; Temperature measurement;
Conference_Titel :
3D Systems Integration Conference (3DIC), 2011 IEEE International
Conference_Location :
Osaka
Print_ISBN :
978-1-4673-2189-1
DOI :
10.1109/3DIC.2012.6262994
