Title :
Scalable direct bond technology and applications driving adoption
Author_Institution :
Ziptronix, Inc., Morrisville, NC, USA
fDate :
Jan. 31 2012-Feb. 2 2012
Abstract :
Low temperature direct bond technology has the potential to become an industry standard bonding technology due to its inherent scalability, low cost, and compatibility with industry standard manufacturing. These benefits of the technology are reviewed as well as applications that are driving its adoption as an industry standard.
Keywords :
cryogenic electronics; electronics packaging; manufacturing industries; applications driving adoption; industry standard bonding technology; industry standard manufacturing; inherent scalability; low temperature direct bond technology; scalable direct bond technology; Backside Illuminated Image Sensors; Bonding; Direct Bond Interconnect; Direct Bonding; Direct Copper Bonding; Direct Internal Metal Thermo-Compression Bonding; Direct Metal Bonding; Direct Oxide Bonding; Fine Pitch 3D Interconnect; Focal Plane Arrays; Heterogeneous; Integration; Molecular Bonding; Non-Adhesive Bonding; Pico Projectors; Reliability;
Conference_Titel :
3D Systems Integration Conference (3DIC), 2011 IEEE International
Conference_Location :
Osaka
Print_ISBN :
978-1-4673-2189-1
DOI :
10.1109/3DIC.2012.6263013
