DocumentCode
566273
Title
Scalable direct bond technology and applications driving adoption
Author
Enquist, A.
Author_Institution
Ziptronix, Inc., Morrisville, NC, USA
fYear
2012
fDate
Jan. 31 2012-Feb. 2 2012
Firstpage
1
Lastpage
5
Abstract
Low temperature direct bond technology has the potential to become an industry standard bonding technology due to its inherent scalability, low cost, and compatibility with industry standard manufacturing. These benefits of the technology are reviewed as well as applications that are driving its adoption as an industry standard.
Keywords
cryogenic electronics; electronics packaging; manufacturing industries; applications driving adoption; industry standard bonding technology; industry standard manufacturing; inherent scalability; low temperature direct bond technology; scalable direct bond technology; Backside Illuminated Image Sensors; Bonding; Direct Bond Interconnect; Direct Bonding; Direct Copper Bonding; Direct Internal Metal Thermo-Compression Bonding; Direct Metal Bonding; Direct Oxide Bonding; Fine Pitch 3D Interconnect; Focal Plane Arrays; Heterogeneous; Integration; Molecular Bonding; Non-Adhesive Bonding; Pico Projectors; Reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
3D Systems Integration Conference (3DIC), 2011 IEEE International
Conference_Location
Osaka
Print_ISBN
978-1-4673-2189-1
Type
conf
DOI
10.1109/3DIC.2012.6263013
Filename
6263013
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