Development of pixel detectors for particle physics using SLID-ICV interconnection technology

Author

Moser, H.-G. ; Andricek, L. ; Beimforde, M. ; Liemann, G. ; Macchiolo, A. ; Nisius, R. ; Richter, R.H. ; Weigell, P.

Author_Institution

Max Planck-Inst. for Phys., Munich, Germany

fYear

2012

fDate

Jan. 31 2012-Feb. 2 2012

Firstpage

1

Lastpage

4

Abstract

Using the SLID-ICV technology from Fraunhofer EMFT (´Solid-liquid-InterDiffusion´ and ´Inter Chip Vias´[1]) thin pixel sensors (75μm-150μm) with 50μm × 400μm pixel size are connected to the readout ASICs (ATLAS FE-I3). These technologies offer the possibility to construct pixel detectors for application in high energy physics (and elsewhere) with improved properties like smaller pixel size, less material, better fill factor, and backside connectivity. The project is performed in two stages. First sensor and ASIC are connected with the SLID technology. In a second stage this concept will be complemented with vias. Results of step one and status of step two will be reported.

Keywords

application specific integrated circuits; integrated circuit interconnections; particle accelerators; sensors; Fraunhofer EMFT; SLID-ICV interconnection technology; high energy physics; inter chip vias; particle accelerators; particle physics; pixel detector development; pixel sensors; readout ASIC; size 75 mum to 150 mum; solid-liquid-interdiffusion;

fLanguage

English

Publisher

ieee

Conference_Titel

3D Systems Integration Conference (3DIC), 2011 IEEE International

Conference_Location

Osaka

Print_ISBN

978-1-4673-2189-1

Type

conf

DOI

10.1109/3DIC.2012.6263021

Filename

6263021