DocumentCode
566286
Title
A middle-grain circuit partitioning strategy for 3-D integrated floating-point multipliers
Author
Tada, Jubee ; Egawa, Ryusuke ; Kawai, Kazushige ; Kobayashi, Hiroaki ; Goto, Gensuke
Author_Institution
Grad. Sch. of Sci. & Eng., Yamagata Univ., Yonezawa, Japan
fYear
2012
fDate
Jan. 31 2012-Feb. 2 2012
Firstpage
1
Lastpage
6
Abstract
Three-dimensional (3-D) integration technologies have been expected to overcome the limitations of conventional microprocessors, which integrated by two-dimensional (2-D) implementation technologies. This paper focuses on a circuit partitioning strategy for 3-D integrated circuit designs, because it plays important roles to exploit the potential of 3-D integrated circuits. A middle-grain circuit partitioning strategy for 3-D integrated floating-point multipliers is proposed and evaluated in this paper. The proposed strategy equalizes the area of each layer and avoids the critical path to across different layers as much as possible A double-precision 3-D integrated floating-point multiplier which designed by the proposed circuit partitioning strategy achieves 42% delay reduction compared to the 2-D implementation.
Keywords
floating point arithmetic; microprocessor chips; three-dimensional integrated circuits; 2D implementation technology; 3D integrated floating-point multipliers; conventional microprocessors; middle-grain circuit partitioning strategy; three-dimensional integration technology; two-dimensional implementation technology; Adders; Delay; Logic gates; Microprocessors; Silicon; Through-silicon vias; Wires; 3-D integration; TSV; floating-point arithmetic units;
fLanguage
English
Publisher
ieee
Conference_Titel
3D Systems Integration Conference (3DIC), 2011 IEEE International
Conference_Location
Osaka
Print_ISBN
978-1-4673-2189-1
Type
conf
DOI
10.1109/3DIC.2012.6263031
Filename
6263031
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