• DocumentCode
    566286
  • Title

    A middle-grain circuit partitioning strategy for 3-D integrated floating-point multipliers

  • Author

    Tada, Jubee ; Egawa, Ryusuke ; Kawai, Kazushige ; Kobayashi, Hiroaki ; Goto, Gensuke

  • Author_Institution
    Grad. Sch. of Sci. & Eng., Yamagata Univ., Yonezawa, Japan
  • fYear
    2012
  • fDate
    Jan. 31 2012-Feb. 2 2012
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Three-dimensional (3-D) integration technologies have been expected to overcome the limitations of conventional microprocessors, which integrated by two-dimensional (2-D) implementation technologies. This paper focuses on a circuit partitioning strategy for 3-D integrated circuit designs, because it plays important roles to exploit the potential of 3-D integrated circuits. A middle-grain circuit partitioning strategy for 3-D integrated floating-point multipliers is proposed and evaluated in this paper. The proposed strategy equalizes the area of each layer and avoids the critical path to across different layers as much as possible A double-precision 3-D integrated floating-point multiplier which designed by the proposed circuit partitioning strategy achieves 42% delay reduction compared to the 2-D implementation.
  • Keywords
    floating point arithmetic; microprocessor chips; three-dimensional integrated circuits; 2D implementation technology; 3D integrated floating-point multipliers; conventional microprocessors; middle-grain circuit partitioning strategy; three-dimensional integration technology; two-dimensional implementation technology; Adders; Delay; Logic gates; Microprocessors; Silicon; Through-silicon vias; Wires; 3-D integration; TSV; floating-point arithmetic units;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    3D Systems Integration Conference (3DIC), 2011 IEEE International
  • Conference_Location
    Osaka
  • Print_ISBN
    978-1-4673-2189-1
  • Type

    conf

  • DOI
    10.1109/3DIC.2012.6263031
  • Filename
    6263031