DocumentCode
566295
Title
Design exploration of 3D stacked non-volatile memory by conductive bridge based crossbar
Author
Wang, Yuhao ; Zhang, Chun ; Nadipalli, Revanth ; Yu, Hao ; Weerasekera, Roshan
Author_Institution
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
fYear
2012
fDate
Jan. 31 2012-Feb. 2 2012
Firstpage
1
Lastpage
6
Abstract
Non-volatile memory (NVM) is one recent promising solution to build the next generation of memory system. Compared to other non-volatile devices such as flash, phase-change random-access-memory (PCRAM), memristor and etc., the emerging conductive-bridge random-access-memory (CBRAM) has shown advantages in accessing speed, power and endurance. In this paper, design of 3D-stacked NVM is explored with the use of CBRAM-crossbar. Specifically, accurate performance modeling of CBRAM-crossbar structure is studied within the corresponding design platform developed at device and system levels. Experiments show that, compared to PCRAM, the proposed CBRAM-crossbar based memory achieves 10x~100x faster accessing time, at least 100x less operation power, and 100x longer endurance.
Keywords
flash memories; memristors; phase change memories; 3D stacked nonvolatile memory; 3D-stacked NVM; CBRAM-crossbar; conductive bridge based crossbar; conductive-bridge random-access-memory; flash memory; memristor; phase-change random-access-memory; CMOS integrated circuits; Delay; Integrated circuit modeling; Nonvolatile memory; Phase change random access memory; Writing;
fLanguage
English
Publisher
ieee
Conference_Titel
3D Systems Integration Conference (3DIC), 2011 IEEE International
Conference_Location
Osaka
Print_ISBN
978-1-4673-2189-1
Type
conf
DOI
10.1109/3DIC.2012.6263047
Filename
6263047
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