Fast Contour Integral Equation Method for Wideband Power Integrity Analysis

The contour integral equation method has been used for system-level power integrity analysis of electronic packages. But, wideband simulation of complex package structures necessitates a fast contour integral equation (CIE) method. For this purpose, we propose both a priori and a posteriori approaches to speed up the CIE method for fast wideband simulation of power ground planes. First, the speedup is achieved by means of a priori approach, i.e., fast matrix filling using Hankel function interpolation. Second, a posteriori approach using the vector-fitting-based adaptive frequency sampling is combined with the CIE method for fast wideband analysis. We specifically propose an automatic band split algorithm to confine the order of the vector fitting model and ensure fast model convergence. Numerical and experimental results are presented to validate the accuracy and demonstrate the efficiency of the proposed acceleration techniques.