DocumentCode
5683
Title
Piezoresistive Readout Mechanically Coupled Lamé Mode SOI Resonator With
of a Million
Author
Haoshen Zhu ; Yuanjie Xu ; Lee, Joshua E.-Y
Author_Institution
Dept. of Electron. Eng., City Univ. of Hong Kong, Hong Kong, China
Volume
24
Issue
4
fYear
2015
fDate
Aug. 2015
Firstpage
771
Lastpage
780
Abstract
This paper describes the use of the coupling beam in a pair of mechanically coupled Lamé mode resonators to enhance electromechanical transduction by piezoresistive sensing, while at the same time maintaining a high quality factor of a million. This corresponds to an fQ product of 1.3 × 1013, which approaches the Akhiezer limit of silicon. With a 15 mA bias current, electrical characterization of the array using the piezoresistive readout via the coupling-beam provides a 25 dB enhancement over a single Lamé mode resonator using capacitive readout. In this paper, we have modeled the piezoresistive electromechanical frequency response function of the device both analytically and by finite elements. The models mutually agree and are experimentally verified by measured results of fabricated resonators. The model indicates that the transduction factor is independent of the lateral dimensions and thickness of the resonator.
Keywords
Q-factor; finite element analysis; frequency response; microcavities; micromechanical resonators; piezoresistive devices; readout electronics; silicon-on-insulator; Akhiezer limit; SOI resonator; capacitive readout; coupling beam; coupling-beam; current 15 mA; electrical characterization; electromechanical transduction; finite elements; lateral dimensions; piezoresistive electromechanical frequency response function; piezoresistive readout mechanically coupled Lame mode; piezoresistive sensing; quality factor; transduction factor; Acoustic beams; Analytical models; Computational modeling; Couplings; Iron; Piezoresistance; Stress; Microresonators; bulk acoustic devices; bulk acoustic devices.; mechanical-coupling; piezoresistive; quality factor;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/JMEMS.2015.2414441
Filename
7072458
Link To Document