DocumentCode
568872
Title
Understanding S-parameter vs. equivalent circuit-based models for surface mount RLC devices
Author
Dunleavy, Lawrence P.
fYear
2012
fDate
26-26 March 2012
Firstpage
15
Lastpage
15
Abstract
Summary form only given. For many years, S-parameter data files have been the default industry standard for representing passive surface mount devices in the microwave industry. In many cases, however, S-parameters fall short in terms of equipping designers with the simulation capability that is needed for circuit design success. In contrast, a properly extracted equivalent circuit model can avoid many inherent limitations of data file representations and provide for extrapolation, scaling, and statistical yield analyses not easily accomplished with S-parameters alone. This talk will discuss “best-practice” surface-mount component modeling from a number of points of view. Several examples will be presented to illustrate common problems and solutions that can be accomplished using a combination of modern tools. These tools include on-board RF probing, electromagnetic analysis and complex equivalent circuit modeling. Resulting models enable simulations that can very accurately represent microwave as well as mm-wave passive surface mount devices in ways that enable reliably successful circuit design flows from synthesis, through optimization and yield analysis to measured results that correlate well with simulation predictions.
Keywords
RLC circuits; S-parameters; equivalent circuits; extrapolation; microwave circuits; millimetre wave circuits; statistical analysis; surface mount technology; S-parameter data files; best-practice surface-mount component modeling; circuit design; data file representations; electromagnetic analysis; equivalent circuit-based models; extrapolation; microwave passive surface mount devices; millimetre-wave passive surface mount devices; on-board RF probing; statistical yield analysis; surface mount RLC devices;
fLanguage
English
Publisher
iet
Conference_Titel
Passive RF and Microwave Components, 3rd Annual Seminar on
Conference_Location
London
Electronic_ISBN
978-1-84919-542-3
Type
conf
DOI
10.1049/ic.2012.0060
Filename
6297599
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