• DocumentCode
    568872
  • Title

    Understanding S-parameter vs. equivalent circuit-based models for surface mount RLC devices

  • Author

    Dunleavy, Lawrence P.

  • fYear
    2012
  • fDate
    26-26 March 2012
  • Firstpage
    15
  • Lastpage
    15
  • Abstract
    Summary form only given. For many years, S-parameter data files have been the default industry standard for representing passive surface mount devices in the microwave industry. In many cases, however, S-parameters fall short in terms of equipping designers with the simulation capability that is needed for circuit design success. In contrast, a properly extracted equivalent circuit model can avoid many inherent limitations of data file representations and provide for extrapolation, scaling, and statistical yield analyses not easily accomplished with S-parameters alone. This talk will discuss “best-practice” surface-mount component modeling from a number of points of view. Several examples will be presented to illustrate common problems and solutions that can be accomplished using a combination of modern tools. These tools include on-board RF probing, electromagnetic analysis and complex equivalent circuit modeling. Resulting models enable simulations that can very accurately represent microwave as well as mm-wave passive surface mount devices in ways that enable reliably successful circuit design flows from synthesis, through optimization and yield analysis to measured results that correlate well with simulation predictions.
  • Keywords
    RLC circuits; S-parameters; equivalent circuits; extrapolation; microwave circuits; millimetre wave circuits; statistical analysis; surface mount technology; S-parameter data files; best-practice surface-mount component modeling; circuit design; data file representations; electromagnetic analysis; equivalent circuit-based models; extrapolation; microwave passive surface mount devices; millimetre-wave passive surface mount devices; on-board RF probing; statistical yield analysis; surface mount RLC devices;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Passive RF and Microwave Components, 3rd Annual Seminar on
  • Conference_Location
    London
  • Electronic_ISBN
    978-1-84919-542-3
  • Type

    conf

  • DOI
    10.1049/ic.2012.0060
  • Filename
    6297599