• DocumentCode
    56961
  • Title

    Improvement of Data Retention During Long-Term Use by Suppressing Conductive Filament Expansion in {\\rm TaO}_{x} Bipolar-ReRAM

  • Author

    Ninomiya, Tamotsu ; Muraoka, S. ; Zhiqiang Wei ; Yasuhara, R. ; Katayama, Kengo ; Takagi, Toshiyuki

  • Author_Institution
    Device Solutions Center, Panasonic Corp., Kyoto, Japan
  • Volume
    34
  • Issue
    6
  • fYear
    2013
  • fDate
    Jun-13
  • Firstpage
    762
  • Lastpage
    764
  • Abstract
    We investigate, for the first time, the expansion of resistive random access memory (ReRAM) conductive filaments during pulse cycles, which may cause retention failure after cycling endurance. We find that filament size becomes larger gradually because of oxygen diffusion from the region surrounding a filament during reset operations. To achieve long-term use of ReRAM while avoiding filament expansion, it is the key to control both an electric power and a pulsewidth input at a switching operation. We successfully demonstrate good data retention even after endurance of 100-k cycles with an optimized reset pulse.
  • Keywords
    random-access storage; tantalum compounds; TaOx; bipolar-ReRAM; bipolar-resistive random access memory conductive filaments; conductive filament expansion suppression; data retention improvement; filament expansion avoidance; optimized reset pulse; oxygen diffusion; pulse cycles; pulsewidth input; switching operation; Conductive filament (CF); endurance; joule heating; resistive switching random access memory (RAM); retention;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2013.2258653
  • Filename
    6515304