The role of organic compounds in simulation of dust environments for electric contacts

Organic compounds were shown to exist on the failed electric contacts of printed circuit boards in mobile phones. The compounds adhered to both dust particles and wear debris and caused contact failure under dynamic conditions. As one of the organic compounds found on the contaminated electric contacts in failed mobile phones, sodium lactate was chosen for investigation. The physical characteristics of sodium lactate were measured so that the adhesive function of sodium lactate with dust particles could be estimated theoretically and proven by vibration experiments. The hygroscopic and evaporative performance of the sodium lactate was tested, and the relationship between the hygroscopic performance and the insulation resistance was also discussed. The electrical behavior of the dust contaminated contacts with the organics was studied by sliding tests. The experimental results could lead to a method for applying organics in the simulation of dust environments for electric contacts.