DocumentCode :
569852
Title :
Experimental and numerical studies of a multi-leaf clamped lap joint design for aluminium bus bar applications
Author :
Molenaar, D. ; Kilpatrick, Torin ; Gunasegaram, Dayalan
Author_Institution :
CSIRO Process Sci. & Eng., Melbourne, VIC, Australia
fYear :
2012
fDate :
14-17 May 2012
Firstpage :
124
Lastpage :
129
Abstract :
A low electrical resistance, multi-leaf, clamped bus bar connection has been proposed to facilitate installation and removal of related process equipment. Whilst elastic deformation of the bus bar contact members will allow for some variation in thickness, the design may be sensitive to relatively tight tolerances on bus bar thickness due to the highly constrained arrangement of clamping across the multiple bus bars in contact. Experimental and numerical studies were conducted at up to 200 °C operating temperature to determine the exact impact of variation in bus bar thickness on the distribution of contact pressure and hence impact on contact resistance for a multi-leaf clamped lap joint design for aluminium bus bar applications. The studies show that when a significant gap is introduced into the highly constrained arrangement, there is insufficient deformation possible in the contact members to close this gap, even at 200 °C operation. Both the experimental and modeling studies suggested there would be a 12 mV penalty for the proposed connection, when one of the four parallel contact pairs are not in contact.
Keywords :
busbars; contact resistance; elastic deformation; electrical contacts; numerical analysis; aluminium busbar applications; busbar contact members; busbar thickness; contact pressure distribution; contact resistance; elastic deformation; low electrical resistance; multileaf clamped lap joint design; parallel contact pairs; process equipment; temperature 200 degC; voltage 12 mV; contact pressure; contact resistance; contact resistivity; surface finish;
fLanguage :
English
Publisher :
iet
Conference_Titel :
Electrical Contacts (ICEC 2012), 26th International Conference on
Conference_Location :
Beijing
Electronic_ISBN :
978-1-84919-508-9
Type :
conf
DOI :
10.1049/cp.2012.0634
Filename :
6301879
Link To Document :
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