DocumentCode
569882
Title
Method for calculation of contact resistance and finite element simulation of contact temperature rise based on rough surface contact model
Author
Wang Shujuan ; Hu Fang ; Su Bonan ; Zhai Guofu
Author_Institution
Sch. of Electr. Eng. & Autom., Harbin Inst. of Technol., Harbin, China
fYear
2012
fDate
14-17 May 2012
Firstpage
317
Lastpage
321
Abstract
Calculation of contact resistance is closely related to the accuracy of switches´ thermal simulation, though this issue is still in lack of effective method until now. This paper presented a new method for accurate acquirement of contact resistance and temperature rise based on rough surface contact model and finite element simulation. The relation between contact resistance and contact force was developed with the surface profile and the separation between reference planes of contacting surfaces. An equivalent contact model was built with the separation and real contact area in 3-D thermal-electrical coupled finite element simulation to acquire contact temperature rise. Experiments were conducted to verify this method. The research would provide an accurate and effective method for calculation of contact resistance and simulation of contact temperature rise.
Keywords
contact resistance; finite element analysis; 3D thermal-electrical coupled finite element simulation; contact force; contact resistance calculation; contact temperature; equivalent contact model; rough surface contact model; switches thermal simulation; temperature rise; contact model; contact resistance; contact temperature rise; finite element simulation;
fLanguage
English
Publisher
iet
Conference_Titel
Electrical Contacts (ICEC 2012), 26th International Conference on
Conference_Location
Beijing
Electronic_ISBN
978-1-84919-508-9
Type
conf
DOI
10.1049/cp.2012.0668
Filename
6301913
Link To Document