Title :
Method for calculation of contact resistance and finite element simulation of contact temperature rise based on rough surface contact model
Author :
Wang Shujuan ; Hu Fang ; Su Bonan ; Zhai Guofu
Author_Institution :
Sch. of Electr. Eng. & Autom., Harbin Inst. of Technol., Harbin, China
Abstract :
Calculation of contact resistance is closely related to the accuracy of switches´ thermal simulation, though this issue is still in lack of effective method until now. This paper presented a new method for accurate acquirement of contact resistance and temperature rise based on rough surface contact model and finite element simulation. The relation between contact resistance and contact force was developed with the surface profile and the separation between reference planes of contacting surfaces. An equivalent contact model was built with the separation and real contact area in 3-D thermal-electrical coupled finite element simulation to acquire contact temperature rise. Experiments were conducted to verify this method. The research would provide an accurate and effective method for calculation of contact resistance and simulation of contact temperature rise.
Keywords :
contact resistance; finite element analysis; 3D thermal-electrical coupled finite element simulation; contact force; contact resistance calculation; contact temperature; equivalent contact model; rough surface contact model; switches thermal simulation; temperature rise; contact model; contact resistance; contact temperature rise; finite element simulation;
Conference_Titel :
Electrical Contacts (ICEC 2012), 26th International Conference on
Conference_Location :
Beijing
Electronic_ISBN :
978-1-84919-508-9
DOI :
10.1049/cp.2012.0668