DocumentCode :
569884
Title :
Constriction current behavior of oxide film effect observed by using LED wafer
Author :
Sawada, Syo ; Tsukiji, Shigeki ; Tamai, Terutaka ; Hattori, Yoshiyuki
Author_Institution :
Grad. Sch. of Eng., Mie Univ., Tsu, Japan
fYear :
2012
fDate :
14-17 May 2012
Firstpage :
326
Lastpage :
330
Abstract :
In order to clarify the theory of contact resistance, there are many reports in these years. Mathematically the constriction current is derived from Laplace equation at one contact which shape is circle, ellipse, triangle and square. And numerical approach for constriction current analysis was also preformed by Minowa and Sawada. Although there are many reports on the contact resistance measurement, not many reports on the detailed behavior of current density distribution in the contact area experimentally. Therefore, we attempted to observe the behavior of the current density distribution in the contact by using semiconductor wafers. As a result, it was confirmed that electric current is uniformly distributed over the contact area covered by an oxide film, while it is concentrated at the periphery of the contact if there is no oxide film at contact. And the contact resistance of apparent contact area is almost same as real contact area which is also agree with the theory of multi-spot contact. Moreover, the contact resistance is influenced by wafer thickness.
Keywords :
Laplace equations; contact resistance; current density; electric resistance measurement; electrical contacts; light emitting diodes; LED wafer; Laplace equation; apparent contact area; constriction current analysis; contact resistance measurement; current density distribution; electric current; multispot contact; oxide film effect; semiconductor wafers; Constriction Resistance; Contact Resistance; Current Constriction; Current Density Distribution; Direct observation; Electrical Contact; Light Emitting Diode;
fLanguage :
English
Publisher :
iet
Conference_Titel :
Electrical Contacts (ICEC 2012), 26th International Conference on
Conference_Location :
Beijing
Electronic_ISBN :
978-1-84919-508-9
Type :
conf
DOI :
10.1049/cp.2012.0670
Filename :
6301915
Link To Document :
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