Design and Technology Preparation for the ITER HTSCL

Author

Tingzhi Zhou ; Kun Lu ; Qingxiang Ran ; Kaizhong Ding ; Hansheng Feng ; Huan Wu ; Chenlian Liu ; Yuntao Song ; Erwu Niu ; Bauer, Pavol

Author_Institution

Inst. of Plasma Phys., Hefei, China

Volume

24

Issue

3

fYear

2014

fDate

Jun-14

Firstpage

1

Lastpage

5

Abstract

ASIPP will supply for ITER all the current leads. There are three types of high temperature superconducting (HTS) current leads designed to carry 68 kA, 55 kA, or 10 kA to the ITER magnets. Different from the trial leads manufactured and tested in Institute of Plasma Physics, Chinese Academy of Sciences (ASIPP), some critical technologies were qualified before the manufacturing of the ITER leads could commence, including: 1) welding, brazing, and soldering qualification; 2) fin type heat exchanger (HEX) with tight assembly tolerance; 3) low temperature superconducting (LTS) linker with cables soldered to the 5 K copper terminal; 4) instrumentation mock-up for the temperature and voltage test. In this paper, the outcome of these qualification activities will be reported together with the plans for the series production planning and development.

Keywords

brazing; copper; heat exchangers; high-temperature superconductors; superconducting cables; superconducting device testing; superconducting magnets; welding; Cu; ITER HTSCL; ITER magnets; brazing; cables; copper terminal; current 10 kA; current 55 kA; current 68 kA; fin type heat exchanger; high temperature superconducting current leads; instrumentation mock-up; low temperature superconducting linker; series production planning; soldering; technology preparation; temperature 5 K; temperature test; tight assembly tolerance; voltage test; welding; Assembly; Copper; Electron tubes; High-temperature superconductors; Joints; Qualifications; Welding; Current lead; NbTi; heat exchanger; mock-up; qualification;

fLanguage

English

Journal_Title

Applied Superconductivity, IEEE Transactions on

Publisher

ieee

ISSN

1051-8223

Type

jour

DOI

10.1109/TASC.2013.2286177

Filename

6636066