DocumentCode
571147
Title
Integrated power electronic solutions for renewable energy utilization
Author
Stockmeier ; Grasshoff, Thomas
Author_Institution
SEMIKRON Elektron. GmbH & Co. KG, Nuremberg, Germany
fYear
2012
fDate
29-31 May 2012
Firstpage
1
Lastpage
5
Abstract
Different Power Electronic Solutions ranging from 500 kW up to 6 MW comprising power semiconductor devices, DC link capacitors, heatsink, and gate & sense electronics are discussed incorporating new device and packaging technologies, such as SKiiP and SKiN packaging technology, and topologies such as 3-level or even multi-level to cover the wide power range. The design of these Solutions will be reviewed under particular consideration of specific renewable energy requirements, such as reliability, durability and environmental conditions. It can be concluded that rack mountable power semiconductor Solutions can exhibit very high power densities and can provide an effective way to build solar or wind power systems from standardized components.
Keywords
power capacitors; power semiconductor devices; renewable energy sources; solar power stations; wind power plants; DC link capacitors; SKiN packaging technology; SKiiP; gate & sense electronics; heatsink; integrated power electronic solutions; packaging technologies; power 500 kW to 6 MW; power semiconductor devices; rack mountable power semiconductor; renewable energy utilization; solar power systems; wind power systems; Density measurement; Inverters; Multichip modules; Power system measurements; Topology; Wind power generation; Wind turbines; Converters; Inverters; Power semiconductor devices; Semiconductor device packaging; Solar power generation; Wind power generation;
fLanguage
English
Publisher
ieee
Conference_Titel
Energytech, 2012 IEEE
Conference_Location
Cleveland, OH
Print_ISBN
978-1-4673-1836-5
Electronic_ISBN
978-1-4673-1834-1
Type
conf
DOI
10.1109/EnergyTech.2012.6304649
Filename
6304649
Link To Document