DocumentCode
571186
Title
Silicon carbide power device status and issue
Author
Kub, Fritz J.
Author_Institution
Power Electron Branch, Naval Res. Lab., Washington, DC, USA
fYear
2012
fDate
29-31 May 2012
Firstpage
1
Lastpage
5
Abstract
In this paper, the status and issues of primary silicon carbide devices types are reviewed. The device types reviewed include SiC MOSFET, JFET, bipolar, IGBT, thyristor and JBS diodes. In addition, the key issues relating SiC material to device reliability and performance are identified.
Keywords
insulated gate bipolar transistors; junction gate field effect transistors; power MOSFET; power bipolar transistors; power semiconductor switches; silicon compounds; thyristors; IGBT diode; JFET; MOSFET; SiC; bipolar diode; device reliability; silicon carbide power device issue; silicon carbide power device status; thyristor diode; Engines; Epitaxial growth; Insulated gate bipolar transistors; Semiconductor device reliability; Silicon carbide; Switches; Bipolar transistor; JFETs; Schottky diode; insulated gate bipolar transistors; power MOSFETs; power semiconductor devices; power transistor; semiconductor epitaxial layers; silicon carbide; thyristor;
fLanguage
English
Publisher
ieee
Conference_Titel
Energytech, 2012 IEEE
Conference_Location
Cleveland, OH
Print_ISBN
978-1-4673-1836-5
Electronic_ISBN
978-1-4673-1834-1
Type
conf
DOI
10.1109/EnergyTech.2012.6304688
Filename
6304688
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