• DocumentCode
    57127
  • Title

    Cooperative On-Chip Temperature EstimationUsing Multiple Virtual Sensors

  • Author

    Jun Yong Shin ; Kurdahi, Fadi ; Dutt, Nikil

  • Author_Institution
    Center for Embedded & Cyber-Phys. Syst., Univ. of California, Irvine, Irvine, CA, USA
  • Volume
    7
  • Issue
    2
  • fYear
    2015
  • fDate
    Jun-15
  • Firstpage
    37
  • Lastpage
    40
  • Abstract
    A variety of dynamic thermal management (DTM) schemes have been proposed to address the adverse effects of high temperatures on a chip. These DTM schemes rely on on-chip thermal sensors to get accurate temperature information over a die, and typically assume on-chip thermal sensors give accurate temperature readings. However, on-chip thermal sensors with small footprint and low power consumption, such as popular ring-oscillator (RO) based sensors, have relatively low accuracy. We address the challenging question of how to acquire accurate temperature information of a chip during its runtime using small, low-power on-chip thermal sensors. We propose a novel approach of using multiple virtual thermal sensors to increase the accuracy of temperature readings; the virtual thermal sensors are generated from a small low-power physical thermal sensor by adaptively switching its calibration points on the run. Simulation results show that the RMS error of temperature readings can be reduced by up to 91.1% with the use of four virtual thermal sensors as compared with a single thermal sensor case.
  • Keywords
    oscillators; sensor fusion; temperature sensors; thermal management (packaging); virtual instrumentation; cooperative on-chip temperature estimation; dynamic thermal management; low power consumption; multiple virtual sensors; on-chip thermal sensors; ring-oscillator based sensors; small footprint; Accuracy; Calibration; Estimation; System-on-chip; Temperature sensors; Calibration; dynamic thermal management (DTM); temperature estimation; thermal sensors; virtual sensors;
  • fLanguage
    English
  • Journal_Title
    Embedded Systems Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1943-0663
  • Type

    jour

  • DOI
    10.1109/LES.2015.2400992
  • Filename
    7035030