Title :
Study of underfill-to-soldermask delamination in flip-chip packages
Author :
Oh, Z.Y. ; Newman, R. ; Ong, M.C. ; Foo, F.J.
Author_Institution :
Device Anal. Lab., Adv. Micro Devices (Singapore) Pte Ltd., Singapore, Singapore
Abstract :
Interfacial adhesion is critical to the reliability of flip-chip packages. A series of DOE studies were done to ensure and enhance the underfill-to-soldermask adhesion. It was found that vibration testing is most effective in simulating underfill-to-soldermask delamination. A rougher substrate soldermask surface and assembly with cleanable flux improves underfill-to-soldermask adhesion.
Keywords :
adhesion; assembling; design of experiments; dynamic testing; flip-chip devices; integrated circuit packaging; integrated circuit reliability; masks; solders; DOE study; assembly; cleanable flux; design of experiment; flip-chip package; interfacial adhesion; reliability; substrate soldermask surface; underfill-to-soldermask adhesion; underfill-to-soldermask delamination; vibration testing; Adhesives; Delamination; Rough surfaces; Substrates; Surface roughness; Vehicles; Vibrations;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2012 19th IEEE International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-0980-6
DOI :
10.1109/IPFA.2012.6306258
