DocumentCode
571845
Title
Study of underfill-to-soldermask delamination in flip-chip packages
Author
Oh, Z.Y. ; Newman, R. ; Ong, M.C. ; Foo, F.J.
Author_Institution
Device Anal. Lab., Adv. Micro Devices (Singapore) Pte Ltd., Singapore, Singapore
fYear
2012
fDate
2-6 July 2012
Firstpage
1
Lastpage
6
Abstract
Interfacial adhesion is critical to the reliability of flip-chip packages. A series of DOE studies were done to ensure and enhance the underfill-to-soldermask adhesion. It was found that vibration testing is most effective in simulating underfill-to-soldermask delamination. A rougher substrate soldermask surface and assembly with cleanable flux improves underfill-to-soldermask adhesion.
Keywords
adhesion; assembling; design of experiments; dynamic testing; flip-chip devices; integrated circuit packaging; integrated circuit reliability; masks; solders; DOE study; assembly; cleanable flux; design of experiment; flip-chip package; interfacial adhesion; reliability; substrate soldermask surface; underfill-to-soldermask adhesion; underfill-to-soldermask delamination; vibration testing; Adhesives; Delamination; Rough surfaces; Substrates; Surface roughness; Vehicles; Vibrations;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2012 19th IEEE International Symposium on the
Conference_Location
Singapore
ISSN
1946-1542
Print_ISBN
978-1-4673-0980-6
Type
conf
DOI
10.1109/IPFA.2012.6306258
Filename
6306258
Link To Document