Title :
Alternative FIB cross section and laser ablation methods to improve failure analysis throughput of copper wire moisture related reliability failures
Author :
Kho, W.F. ; Leow, J.L. ; Cheah, Y.C. ; Cheah, Y.W.
Author_Institution :
Free Ind. Zone Sungei Way, Freescale Semicond. Malaysia, Petaling Jaya, Malaysia
Abstract :
In analysis of copper wire moisture related reliability failures long hours are spent on the FIB tool. Two techniques are introduced to reduce the long analysis time: 1) An alternative FIB trenching method that reduces milling duration by 5X and, 2) A “FIB-free” approach using laser ablation.
Keywords :
copper; failure analysis; laser ablation; wires (electric); FIB tool; alternative FIB cross section; alternative FIB trenching; analysis time; copper wire moisture related reliability failures; failure analysis throughput; laser ablation; milling duration; Compounds; Copper; Laser ablation; Materials; Milling; Moisture; Wires;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2012 19th IEEE International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-0980-6
DOI :
10.1109/IPFA.2012.6306278