Copper oxidation study by TEM

Author

Esa, S.R. ; Yahya, R. ; Hassan, A. ; Omar, G.

Author_Institution

Infineon Technol. (Kulim) Sdn. Bhd, Kulim, Malaysia

fYear

2012

fDate

2-6 July 2012

Firstpage

1

Lastpage

5

Abstract

This paper studies copper oxidation using Transmission Electron Microscopy (TEM) on copper leadframe which was subjected to heat treatment process at 60°C, 120°C, 150°C, 180°C and 210°C for 0.5 hour. The TEM lamella was prepared by in-situ lift-out technique using Focused Ion Beam (FIB) followed by TEM inspection to reveal the microstructure of copper oxide. Additionally, Electron Energy Loss Spectroscopy (EELS) analysis was carried out on the copper leadframe sample that was baked at 210°C to determine the oxidation state of copper oxide.

Keywords

copper; crystal microstructure; electron energy loss spectra; focused ion beam technology; heat treatment; inspection; oxidation; transmission electron microscopy; Cu; EELS analysis; FIB; TEM inspection; TEM lamella; copper leadframe; copper oxidation state; electron energy loss spectroscopy; focused ion beam; heat treatment process; in-situ lift-out technique; microstructure; temperature 120 degC; temperature 150 degC; temperature 180 degC; temperature 210 degC; temperature 60 degC; time 0.5 hour; transmission electron microscopy; IEEE Xplore; Portable document format;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits (IPFA), 2012 19th IEEE International Symposium on the

Conference_Location

Singapore

ISSN

1946-1542

Print_ISBN

978-1-4673-0980-6

Type

conf

DOI

10.1109/IPFA.2012.6306315

Filename

6306315