• DocumentCode
    572244
  • Title

    The Steady-State Error Analysis of New Type High-Voltage EVT and Its Modification

  • Author

    Hu, Hai-bo ; Zhou, You-qing ; Ji, Zhe

  • Author_Institution
    Electr. & Inf. Eng. Coll., Hunan Univ., Changsha, China
  • fYear
    2012
  • fDate
    27-29 March 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A new principle and method to measure high voltage by detecting current of high-voltage capacitor were proposed, a new type of high-voltage electronic voltage transformer(EVT) based on this method was designed. The steady-error of the EVT was analyzed considering the effects of capacitor temperature and the power frequency. For the temperature effect, thermistor temperature sensor was used to establish temperature compensation and introduce the error correction, so as to reduce the ratio error of EVT. The equivalent circuit of EVT had established, based on this and the signal processing circuit, the relation between primary and secondary voltage was deduced. The possibility of adjusting the frequency characteristic by changing the EVT´s parameters was proved by the MATLAB simulation. Finally, building the steady-error experimental system, the result of high-voltage test shows that these measurements are feasible.
  • Keywords
    error analysis; power transformer testing; signal processing equipment; temperature sensors; thermistors; voltage measurement; EVT equivalent circuit; Matlab simulation; capacitor temperature effects; high voltage measurement; high-voltage EVT; high-voltage capacitor; high-voltage electronic voltage transformer; high-voltage test; power frequency; primary voltage; secondary voltage; signal processing circuit; steady-state error analysis; temperature compensation; thermistor temperature sensor; Capacitors; Resistance; Temperature; Temperature measurement; Thermistors; Voltage measurement; Voltage transformers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power and Energy Engineering Conference (APPEEC), 2012 Asia-Pacific
  • Conference_Location
    Shanghai
  • ISSN
    2157-4839
  • Print_ISBN
    978-1-4577-0545-8
  • Type

    conf

  • DOI
    10.1109/APPEEC.2012.6307432
  • Filename
    6307432