DocumentCode :
57374
Title :
Parallel Transient Simulation of Package/Board Power Distribution Networks Based on a 2-D Overlapping Partitioning Methodology
Author :
Roy, Sandip ; Dounavis, Anestis
Author_Institution :
Dept. of Electr. & Comput. Eng., Colorado State Univ., Fort Collins, CO, USA
Volume :
3
Issue :
12
fYear :
2013
fDate :
Dec. 2013
Firstpage :
2101
Lastpage :
2112
Abstract :
Typical SPICE models for characterization of package/board power distribution networks (PDNs) are based on a 2-D discretization of the Helmholtz wave equation and hence require high computational costs. In this paper, a novel waveform relaxation (WR) algorithm for the parallelizable simulation of PDNs is presented. The key feature of this paper is the development of a 2-D partitioning methodology with overlapping, which addresses the slow convergence of conventional nonoverlapping-based WR algorithms for PDNs. In addition, a hybrid iterative technique is proposed that can provide additional exchange of information between the overlapping subcircuits to further improve the convergence of traditional Gauss-Jacobi-based relaxation iterations. The overall algorithm is highly parallelizable and exhibits good scaling with both the size of the circuit matrices involved and the number of CPUs available. Numerical examples are presented to illustrate the validity and efficiency of the proposed paper.
Keywords :
Helmholtz equations; distribution networks; power transmission lines; waveform analysis; 2-D discretization; 2-d overlapping partitioning methodology; Gauss-Jacobi-based relaxation iterations; Helmholtz wave equation; computational costs; package/board power distribution networks; parallel transient simulation; parallelizable simulation; typical SPICE models; waveform relaxation algorithm; Algorithm design and analysis; Convergence; Partitioning algorithms; Power distribution; Transient analysis; Transmission lines; Convergence analysis; delay; overlapping; power distribution networks; power integrity; simultaneous switching noise; transient simulation; transmission line; waveform relaxation;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2013.2273035
Filename :
6567956
Link To Document :
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