DocumentCode
57374
Title
Parallel Transient Simulation of Package/Board Power Distribution Networks Based on a 2-D Overlapping Partitioning Methodology
Author
Roy, Sandip ; Dounavis, Anestis
Author_Institution
Dept. of Electr. & Comput. Eng., Colorado State Univ., Fort Collins, CO, USA
Volume
3
Issue
12
fYear
2013
fDate
Dec. 2013
Firstpage
2101
Lastpage
2112
Abstract
Typical SPICE models for characterization of package/board power distribution networks (PDNs) are based on a 2-D discretization of the Helmholtz wave equation and hence require high computational costs. In this paper, a novel waveform relaxation (WR) algorithm for the parallelizable simulation of PDNs is presented. The key feature of this paper is the development of a 2-D partitioning methodology with overlapping, which addresses the slow convergence of conventional nonoverlapping-based WR algorithms for PDNs. In addition, a hybrid iterative technique is proposed that can provide additional exchange of information between the overlapping subcircuits to further improve the convergence of traditional Gauss-Jacobi-based relaxation iterations. The overall algorithm is highly parallelizable and exhibits good scaling with both the size of the circuit matrices involved and the number of CPUs available. Numerical examples are presented to illustrate the validity and efficiency of the proposed paper.
Keywords
Helmholtz equations; distribution networks; power transmission lines; waveform analysis; 2-D discretization; 2-d overlapping partitioning methodology; Gauss-Jacobi-based relaxation iterations; Helmholtz wave equation; computational costs; package/board power distribution networks; parallel transient simulation; parallelizable simulation; typical SPICE models; waveform relaxation algorithm; Algorithm design and analysis; Convergence; Partitioning algorithms; Power distribution; Transient analysis; Transmission lines; Convergence analysis; delay; overlapping; power distribution networks; power integrity; simultaneous switching noise; transient simulation; transmission line; waveform relaxation;
fLanguage
English
Journal_Title
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
2156-3950
Type
jour
DOI
10.1109/TCPMT.2013.2273035
Filename
6567956
Link To Document