Title :
Design Considerations for Cooling High Heat Flux IC Chips With Microchannels
Author :
Kandlikar, Satish G.
Author_Institution :
Mech. Eng., Rochester Inst. of Technol., Rochester, NY, USA
Abstract :
Thermal emergency in integrated circuits has become an important issue with aggressive scaling trends. Several novel cooling techniques are investigated in both academia and industry. Sophisticated active cooling techniques are required to mitigate the thermal issues faced by the chips in the current and future technologies.
Keywords :
cooling; integrated circuit design; thermal engineering; cooling high heat flux IC chip; integrated circuit; microchannel; thermal emergency; Coolants; Design methodology; Heat transfer; Heating; Integrated circuits; Microchannels; Tutorials;
Journal_Title :
Design & Test, IEEE
DOI :
10.1109/MDAT.2014.2299535
