A Distributed De-Embedding Solution for CMOS mm-Wave On-Wafer Measurements Based-on Double Open-Short Technique

In this letter, a novel distributed de-embedding solution with double open-short structures are proposed and investigated. The distributed effect is well considered by regarding the interconnection as scalable transmission line at high frequency and all the parasitic parameters can be extracted directly by three steps. Experimental results show this general distributed de-embedding technique provides more stable on-wafer parasitic extraction than well-adopted SLOT de-embedding technique at millimeter-wave frequency.