SI and PI analyses of complex IC packagings using non-conformal domain decomposition methods

In this paper, we present non-conformal, non-overlapping domain decomposition methods (DDMs) for DC IR drop and AC signal integrity (SI) analyses of high-power chip-package-PCBs. The proposed non-conformal DDMs start by partitioning the composite device into inhomogeneous sub-regions with temperature-dependent material properties. Subsequently, each sub-domain is meshed independently according to its own characteristic features. As a consequence, the troublesome mesh-generation task for complex ICs can be greatly relaxed. Numerical example of SI/PI analyses of a complex IC package demonstrates the flexibility and potentials of the proposed non-conformal DDMs.