DocumentCode :
577276
Title :
Condition monitoring of high voltage equipment in smart grid
Author :
Jian Li ; Zhiman He ; Lianwei Bao ; Youyuan Wang ; Lin Du
Author_Institution :
Dept. of High Voltage & Insulation Eng., Chongqing Univ., Chongqing, China
fYear :
2012
fDate :
17-20 Sept. 2012
Firstpage :
608
Lastpage :
612
Abstract :
Smart grid is a very important concept that optimizes and improves the reliability of power transmission systems. The smart grid is required to be more aware of its operative conditions and should have at least some degree of self healing capability. This paper discusses the condition monitoring technologies of HV equipment in smart grid. The development status of condition monitoring technologies in substation, conversion substation, and transmission line are introduced. To solve the problems of condition monitoring systems of power systems, and develop the technologies of condition monitoring in smart grid, the intelligent sensor networks, communication network with IEC 61850 protocol for condition monitoring of HV equipments in smart grid are propoed. At last, the intelligent sensors, intelligent electronic device, the non-contact energy storage and power management module are introduced.
Keywords :
IEC standards; condition monitoring; energy storage; intelligent sensors; power apparatus; power transmission lines; power transmission reliability; protocols; smart power grids; substations; HV equipment; IEC 61850 protocol; communication network; condition monitoring technologies; conversion substation; high voltage equipment; intelligent electronic device; intelligent sensor networks; noncontact energy storage; operative conditions; power management module; power transmission system reliability; self healing capability; smart grid; Condition monitoring; Intelligent sensors; Monitoring; Power transmission lines; Smart grids; Substations; HV equipment; condition monitoring; smart grid;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
High Voltage Engineering and Application (ICHVE), 2012 International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4673-4747-1
Type :
conf
DOI :
10.1109/ICHVE.2012.6357049
Filename :
6357049
Link To Document :
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