DocumentCode
577276
Title
Condition monitoring of high voltage equipment in smart grid
Author
Jian Li ; Zhiman He ; Lianwei Bao ; Youyuan Wang ; Lin Du
Author_Institution
Dept. of High Voltage & Insulation Eng., Chongqing Univ., Chongqing, China
fYear
2012
fDate
17-20 Sept. 2012
Firstpage
608
Lastpage
612
Abstract
Smart grid is a very important concept that optimizes and improves the reliability of power transmission systems. The smart grid is required to be more aware of its operative conditions and should have at least some degree of self healing capability. This paper discusses the condition monitoring technologies of HV equipment in smart grid. The development status of condition monitoring technologies in substation, conversion substation, and transmission line are introduced. To solve the problems of condition monitoring systems of power systems, and develop the technologies of condition monitoring in smart grid, the intelligent sensor networks, communication network with IEC 61850 protocol for condition monitoring of HV equipments in smart grid are propoed. At last, the intelligent sensors, intelligent electronic device, the non-contact energy storage and power management module are introduced.
Keywords
IEC standards; condition monitoring; energy storage; intelligent sensors; power apparatus; power transmission lines; power transmission reliability; protocols; smart power grids; substations; HV equipment; IEC 61850 protocol; communication network; condition monitoring technologies; conversion substation; high voltage equipment; intelligent electronic device; intelligent sensor networks; noncontact energy storage; operative conditions; power management module; power transmission system reliability; self healing capability; smart grid; Condition monitoring; Intelligent sensors; Monitoring; Power transmission lines; Smart grids; Substations; HV equipment; condition monitoring; smart grid;
fLanguage
English
Publisher
ieee
Conference_Titel
High Voltage Engineering and Application (ICHVE), 2012 International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4673-4747-1
Type
conf
DOI
10.1109/ICHVE.2012.6357049
Filename
6357049
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