Title :
Circuit reliability: From Physics to Architectures: Embedded tutorial paper
Author :
Fang, Jianxin ; Gupta, Saket ; Kumar, Sanjay V. ; Marella, Sravan K. ; Mishra, Vivek ; Zhou, Pingqiang ; Sapatnekar, Sachin S.
Author_Institution :
ECE Dept., Univ. of Minnesota, Minneapolis, MN, USA
Abstract :
In the period of extreme CMOS scaling, reliability issues are becoming a critical problem. These problems include issues related to device reliability, in the form of bias temperature instability, hot carrier injection, time-dependent dielectric breakdown of gate oxides, as well as interconnect reliability concerns such as electromigration and TSV stress in 3D integrated circuits. This tutorial surveys these effects, and discusses methods for mitigating them at all levels of design.
Keywords :
CMOS integrated circuits; dielectric devices; electric breakdown; integrated circuit reliability; 3D integrated circuits; TSV stress; bias temperature instability; circuit reliability; electromigration; extreme CMOS scaling; gate oxides; hot carrier injection; interconnect reliability; physics to architectures; time-dependent dielectric breakdown; Degradation; Design automation; Integrated circuit modeling; Integrated circuit reliability; Logic gates; Stress; 3D ICs; Bias temperature instability; electromigration; hot carriers; oxide breakdown; stress;
Conference_Titel :
Computer-Aided Design (ICCAD), 2012 IEEE/ACM International Conference on
Conference_Location :
San Jose, CA
