Title :
Multi-scale, multi-physics analysis for device, chip, package, and board level
Author_Institution :
Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
Abstract :
Summary form only given. The computer integrated circuitmn (IC) is inundated with electromagnetic signals. These signals are omnipresent at the device, chip, package, and board level. The length-scales vary from nanometers to centimeters. The physics also changes significantly over these length-scales. It is clear that multi-scale, multi-physics analyses are needed to understand future generation IC´s.
Keywords :
integrated circuit packaging; network analysis; board level; computer integrated circuitmn; device chip packaging; electromagnetic signal; future generation IC; multiscale multiphysics analysis; Electric breakdown; Electromagnetic fields; Equations; Integrated circuits; Mathematical model; Physics;
Conference_Titel :
Computer-Aided Design (ICCAD), 2012 IEEE/ACM International Conference on
Conference_Location :
San Jose, CA
