Title :
60 GHz on-chip patch antenna integrated in a 0.18-μm CMOS technology
Author :
Hirano, Takuichi ; Okada, Kenichi ; Hirokawa, Jiro ; Ando, Makoto
Author_Institution :
Dept. of Int. Dev. Eng., Tokyo Inst. of Technol., Tokyo, Japan
fDate :
Oct. 29 2012-Nov. 2 2012
Abstract :
Millimeter-wave CMOS RF circuits have been received substantial attention, motivated by the advance of CMOS process. In the millimetre-wave band, the connection, such as wire bonding or flip chip bonding, between the RF circuit and off-chip antenna is not easy task because of the radiation loss and/or adding parasitic components. To overcome the problem, on-chip antennas, which do not suffer from the problem of connection, have been studied by many researchers. Accurate and appropriate modelling in simulation is very important to obtain agreement with measurement.
Keywords :
CMOS integrated circuits; flip-chip devices; lead bonding; microstrip antennas; millimetre wave antennas; CMOS process; CMOS technology; flip chip bonding; frequency 60 GHz; millimeter-wave CMOS RF circuits; millimetre-wave band; off-chip antenna; on-chip patch antenna; parasitic components; radiation loss; size 0.18 mum; wire bonding; Antenna measurements; CMOS integrated circuits; Frequency measurement; Metals; Patch antennas; Semiconductor device modeling; System-on-a-chip;
Conference_Titel :
Antennas and Propagation (ISAP), 2012 International Symposium on
Conference_Location :
Nagoys
Print_ISBN :
978-1-4673-1001-7