Technical requirements for the development of a high performance RF module for airborne radar application

In the framework of the Smartpower project, the technical requirements are key input parameters to develop the technologies and materials that would be necessary for the packaging and thermal management of high power RF modules used in Active Electronically Scanned Array based on GaN transistors. These essential requirements are linked to the very demanding environment constraints for airborne applications and the necessities linked to an optimal electrical RF performance for the packaging. The major mechanical and thermal architecture requirements of a liquid cooled antenna are provided to detail the main characteristics expected from a highly conductive Thermal Interface Material which has to be developed and also the geometrical requirements expected from a low-cost compact packaging which should include industrial constraints for manufacturing. Thermal management requirements linked to the integration of a thermal sensor into the packaging are explained in parallel to the management of power dissipation coming from a GaN high power amplifier. The outcome of the technologies developed by the partners of the consortium will be integrated into a demonstrator that is presented.