Thermal aware design methodology for small signal discrete products

Author

Holland, Steffen ; Rover, Martin ; Kuhl, H. ; Witt, H. ; Quade, R.

Author_Institution

NXP Semicond., Hamburg, Germany

fYear

2012

fDate

25-27 Sept. 2012

Firstpage

1

Lastpage

6

Abstract

A methodology for electro-thermal simulations of discrete semiconductor devices on PCB level is presented. By combining the finite element simulation tools FloTherm and Sentaurus the computation time can be reduced so that it is possible to include the surrounding ambient into the electrothermal model. This is achieved by extraction of thermal resistances using FloTherm which are inserted into Sentaurus as thermal boundary conditions. This approach has been verified with thermal measurements for a set of discrete devices in different packages and PCB layouts. The simulation results agree well with measurement.

Keywords

electronic engineering computing; finite element analysis; printed circuit layout; semiconductor device measurement; semiconductor device packaging; thermal management (packaging); thermal resistance; FloTherm; PCB layout; PCB level; Sentaurus; discrete device; discrete semiconductor device; electro-thermal simulation; electrothermal model; finite element simulation tool; small signal discrete product; thermal aware design methodology; thermal boundary condition; thermal measurement; thermal resistance; Computational modeling; Copper; Current measurement; Heat sinks; Semiconductor device measurement; Temperature measurement; Voltage measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Investigations of ICs and Systems (THERMINIC), 2012 18th International Workshop on

Conference_Location

Budapest

Print_ISBN

978-1-4673-1882-2

Type

conf

Filename

6400599