Quasi — 3D approach for BGA package thermal modeling

Author

Petrosyants, K.O. ; Rjabov, N.I.

Author_Institution

Moscow State Inst. of Electron. & Math. (Tech. Univ.), Moscow, Russia

fYear

2012

fDate

25-27 Sept. 2012

Firstpage

1

Lastpage

4

Abstract

The quasi-3D BGA package thermal model is proposed. The general 3D heat transfer problem is correctly transformed to the set of 2D equations for temperature distribution in different layers of BGA package construction. It is shown that quasi-3D model provides the reasonable accuracy for standard and thermally enhanced BGAs. The software tool OVERHEAT-BGA is developed to obtain an numerical solution with considerably (6-10 times) reduced CPU time in comparison with universal 3D simulators. The good agreement between designed and measured temperatures for standard and XP BGA packages is achieved.

Keywords

ball grid arrays; electronic engineering computing; heat transfer; multiprocessing systems; software packages; software tools; solid modelling; 2D equations; CPU time reduction; OVERHEAT-BGA; XP BGA package construction; ball grid array; general 3D heat transfer problem; numerical solution; quasi3D BGA package thermal model; software tool; temperature distribution; temperatures measured; thermally enhanced BGA; universal 3D simulators; Electronic packaging thermal management; Heating; Materials; Mathematical model; Numerical models; Standards; Temperature distribution;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Investigations of ICs and Systems (THERMINIC), 2012 18th International Workshop on

Conference_Location

Budapest

Print_ISBN

978-1-4673-1882-2

Type

conf

Filename

6400601