• DocumentCode
    586530
  • Title

    Integrated microcooler structure realized by wet chemical etching

  • Author

    Bognar, Gabor ; Plesz, B. ; Szabo, P.G. ; Hantos, Gusztav

  • Author_Institution
    Dept. of Electron Devices, Budapest Univ. of Technol. & Econ., Budapest, Hungary
  • fYear
    2012
  • fDate
    25-27 Sept. 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this paper we summarize the first steps of a new idea to create cost effective microcooler structures with high performance. Our basic idea is to use a cheap etching process instead of reactive ion etching or LIGA technologies. However before we go further into varying the layout in order to increase the cooling efficiency, the performances of the new structures have to be compared against others which were formed either by RIE or LIGA. In order to validate our structures´ cooling capability thermal transient tests were performed. These tests proved are expectation as the cooling efficiencies were almost identical.
  • Keywords
    cooling; etching; thermal management (packaging); wetting; LIGA technologies; RIE; cheap etching process; cooling efficiencies; cooling efficiency; cost effective microcooler structures; high performance; integrated microcooler structure; reactive ion etching; structures cooling capability thermal transient tests; wet chemical etching; Cooling; Electrical resistance measurement; Etching; Heating; Semiconductor device measurement; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Investigations of ICs and Systems (THERMINIC), 2012 18th International Workshop on
  • Conference_Location
    Budapest
  • Print_ISBN
    978-1-4673-1882-2
  • Type

    conf

  • Filename
    6400615