DocumentCode
586530
Title
Integrated microcooler structure realized by wet chemical etching
Author
Bognar, Gabor ; Plesz, B. ; Szabo, P.G. ; Hantos, Gusztav
Author_Institution
Dept. of Electron Devices, Budapest Univ. of Technol. & Econ., Budapest, Hungary
fYear
2012
fDate
25-27 Sept. 2012
Firstpage
1
Lastpage
4
Abstract
In this paper we summarize the first steps of a new idea to create cost effective microcooler structures with high performance. Our basic idea is to use a cheap etching process instead of reactive ion etching or LIGA technologies. However before we go further into varying the layout in order to increase the cooling efficiency, the performances of the new structures have to be compared against others which were formed either by RIE or LIGA. In order to validate our structures´ cooling capability thermal transient tests were performed. These tests proved are expectation as the cooling efficiencies were almost identical.
Keywords
cooling; etching; thermal management (packaging); wetting; LIGA technologies; RIE; cheap etching process; cooling efficiencies; cooling efficiency; cost effective microcooler structures; high performance; integrated microcooler structure; reactive ion etching; structures cooling capability thermal transient tests; wet chemical etching; Cooling; Electrical resistance measurement; Etching; Heating; Semiconductor device measurement; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Investigations of ICs and Systems (THERMINIC), 2012 18th International Workshop on
Conference_Location
Budapest
Print_ISBN
978-1-4673-1882-2
Type
conf
Filename
6400615
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