DocumentCode :
586530
Title :
Integrated microcooler structure realized by wet chemical etching
Author :
Bognar, Gabor ; Plesz, B. ; Szabo, P.G. ; Hantos, Gusztav
Author_Institution :
Dept. of Electron Devices, Budapest Univ. of Technol. & Econ., Budapest, Hungary
fYear :
2012
fDate :
25-27 Sept. 2012
Firstpage :
1
Lastpage :
4
Abstract :
In this paper we summarize the first steps of a new idea to create cost effective microcooler structures with high performance. Our basic idea is to use a cheap etching process instead of reactive ion etching or LIGA technologies. However before we go further into varying the layout in order to increase the cooling efficiency, the performances of the new structures have to be compared against others which were formed either by RIE or LIGA. In order to validate our structures´ cooling capability thermal transient tests were performed. These tests proved are expectation as the cooling efficiencies were almost identical.
Keywords :
cooling; etching; thermal management (packaging); wetting; LIGA technologies; RIE; cheap etching process; cooling efficiencies; cooling efficiency; cost effective microcooler structures; high performance; integrated microcooler structure; reactive ion etching; structures cooling capability thermal transient tests; wet chemical etching; Cooling; Electrical resistance measurement; Etching; Heating; Semiconductor device measurement; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal Investigations of ICs and Systems (THERMINIC), 2012 18th International Workshop on
Conference_Location :
Budapest
Print_ISBN :
978-1-4673-1882-2
Type :
conf
Filename :
6400615
Link To Document :
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