DocumentCode :
586533
Title :
Development and performance of LED metal package with an integrated reflector/heat slug structure
Author :
Jin Hwan Kim ; Jong Hwa Choi ; So Hyeon Mun ; Moo Whan Shin
Author_Institution :
Sch. of Integrated Technol., Yonsei Univ., Incheon, South Korea
fYear :
2012
fDate :
25-27 Sept. 2012
Firstpage :
1
Lastpage :
4
Abstract :
This paper reports on the development of new design of Light Emitting Diode (LED) metal package and its thermal and optical performance. The new package exhibits a reflector integrated with a heat slug as one body. Thermal and optical performance of the package was evaluated and compared with that of commercial plastic LED package for reference. The new metal package showed excellent thermal performance compared with the plastic package (Rth, j-a of 27 K/W vs. 49 K/W and Tj of 57°C vs. 86°C at a driving current of 350 mA). Unexpected from the much better thermal performance, optical power from the metal package was not noticeably higher than that from the plastic package when measured by an integration sphere. Comparison of optical simulation results from 50 cm radius far field and near field receiver indicated a significant optical loss at the reflector surface of the metal package. It was demonstrated that the external optical power of the metal package be significantly improved by the change of reflector design. The external optical power was improved from 145.29 mW to 170.15mW by optimizing the two reflectors´ angles (from 80° and 80° to 55° and 50°, for the 1st and 2nd reflector, respectively).
Keywords :
electronics packaging; light emitting diodes; LED metal package; current 350 mA; far field receiver; integration sphere; light emitting diode metal package; near field receiver; optical performance; plastic package; power 145.29 mW; power 170.15 mW; reflector surface; reflector-heat slug structure; temperature 57 degC; temperature 86 degC; thermal performance; Integrated optics; Light emitting diodes; Metals; Optical receivers; Optical reflection; Optical variables measurement; Plastics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal Investigations of ICs and Systems (THERMINIC), 2012 18th International Workshop on
Conference_Location :
Budapest
Print_ISBN :
978-1-4673-1882-2
Type :
conf
Filename :
6400619
Link To Document :
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