• DocumentCode
    586545
  • Title

    Minimizing thermally induced interfacial shearing stress in a thermoelectric module

  • Author

    Ziabari, Amirkoushyar ; Suhir, E. ; Shakouri, Ali

  • Author_Institution
    Birck Nanotechnol. Center, Purdue Univ., West Lafayette, IN, USA
  • fYear
    2012
  • fDate
    25-27 Sept. 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The problem of minimizing the level of the thermally induced interfacial shearing stress in a Thermo-Electric Module (TEM) is addressed using analytical and finite-element-analysis (FEA) based modeling. The maximum stress is calculated for different leg sizes. Good agreement between the analytical and FEA predictions has been found. It is concluded that the shearing stress can be effectively minimized by using thinner legs with compliant interfaces.
  • Keywords
    finite element analysis; modules; shear deformation; thermal stresses; thermoelectric devices; FEA; TEM; analytical analysis; deformation; finite-element-analysis; leg size; thermally induced interfacial shearing stress minimizing; thermoelectric module; Analytical models; Assembly; Finite element methods; Materials; Shearing; Stress; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Investigations of ICs and Systems (THERMINIC), 2012 18th International Workshop on
  • Conference_Location
    Budapest
  • Print_ISBN
    978-1-4673-1882-2
  • Type

    conf

  • Filename
    6400633
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=586545