Modelling and characterisation of smart power devices

Author

Wunderle, B. ; Ras, M. Abo ; Springborn, M. ; May, Dominik ; Kleff, J. ; Oppermann, H. ; Topper, Michael ; Caroff, T. ; Schacht, R. ; Mitova, R.

Author_Institution

Tech. Univ. Chemnitz, Chemnitz, Germany

fYear

2012

fDate

25-27 Sept. 2012

Firstpage

1

Lastpage

9

Abstract

This paper deals with the system design, technology and test of a novel concept of integrating Si and SiC power dies along with thermo-electric coolers in order to thermally manage transients occurring during operation, thus turning it into a smart power device. The concept features double-sided cooling as well as new materials and joining technologies to integrate the dies such as transient liquid phase bonding/soldering. Coupled-field simulations are used to predict thermal performance and are verified by especially designed test stands to very good agreement. This paper is the first in a series of planned publications on the ongoing work in the project.

Keywords

power semiconductor devices; semiconductor device models; soldering; thermal management (packaging); thermoelectric cooling; transients; coupled-field simulations; designed test; dies; double-sided cooling; phase soldering; planned publications; smart power devices; system design; thermal performance; thermally manage transients; thermo-electric coolers; transient liquid phase bonding; Cooling; Copper; Reliability; Substrates; Thermal resistance; Transient analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Investigations of ICs and Systems (THERMINIC), 2012 18th International Workshop on

Conference_Location

Budapest

Print_ISBN

978-1-4673-1882-2

Type

conf

Filename

6400638