High speed Tilted white-light Scanning Interferometry system for package bumps inspection

Author

Jehhoon Bhang ; Seoungrag Lee ; Kyoungseop Chang ; Youngjun Roh

Author_Institution

Production Eng. Res. Inst., LG Electron., Pyeongtaek, South Korea

fYear

2012

fDate

29-31 Oct. 2012

Firstpage

1

Lastpage

4

Abstract

Tilted white-light Scanning Interferometry(TSI) is oriented from Vertical Scanning white-light interferometry(VSI). TSI is optimized for lateral scanning; it´s possible that scanning object with only one axis movement while VSI have to move more than two axis to scan a object lager than its Field Of View(FOV). This paper introduces implemented system for package bumps scanning using TSI with our own developed high speed camera.

Keywords

automatic optical inspection; cameras; light interferometry; production engineering computing; wafer level packaging; FOV; TSI; VSI; axis movement; field of view; high speed camera; high speed tilted white-light scanning interferometry system; lateral scanning; object scanning; package bump inspection; package bump scanning; vertical scanning white-light interferometry; Cameras; Graphics; Lenses; Tilted white-light Scanning Interferometry (TSI); high speed camera; package bumps; parallel processing;

fLanguage

English

Publisher

ieee

Conference_Titel

Optomechatronic Technologies (ISOT), 2012 International Symposium on

Conference_Location

Paris

Print_ISBN

978-1-4673-2875-3

Type

conf

DOI

10.1109/ISOT.2012.6403238

Filename

6403238