Title :
High speed Tilted white-light Scanning Interferometry system for package bumps inspection
Author :
Jehhoon Bhang ; Seoungrag Lee ; Kyoungseop Chang ; Youngjun Roh
Author_Institution :
Production Eng. Res. Inst., LG Electron., Pyeongtaek, South Korea
Abstract :
Tilted white-light Scanning Interferometry(TSI) is oriented from Vertical Scanning white-light interferometry(VSI). TSI is optimized for lateral scanning; it´s possible that scanning object with only one axis movement while VSI have to move more than two axis to scan a object lager than its Field Of View(FOV). This paper introduces implemented system for package bumps scanning using TSI with our own developed high speed camera.
Keywords :
automatic optical inspection; cameras; light interferometry; production engineering computing; wafer level packaging; FOV; TSI; VSI; axis movement; field of view; high speed camera; high speed tilted white-light scanning interferometry system; lateral scanning; object scanning; package bump inspection; package bump scanning; vertical scanning white-light interferometry; Cameras; Graphics; Lenses; Tilted white-light Scanning Interferometry (TSI); high speed camera; package bumps; parallel processing;
Conference_Titel :
Optomechatronic Technologies (ISOT), 2012 International Symposium on
Conference_Location :
Paris
Print_ISBN :
978-1-4673-2875-3
DOI :
10.1109/ISOT.2012.6403238
