• DocumentCode
    588150
  • Title

    Gate length impact on UTBOX FBRAM devices

  • Author

    Nicoletti, T. ; Santos, S.D. ; Martino, Joao Antonio ; Aoulaiche, Marc ; Veloso, A. ; Jurczak, Malgorzata ; Simoen, Eddy ; Claeys, Cor

  • Author_Institution
    PSI, LSI, Univ. of Sao Paulo, Sao Paulo, Brazil
  • fYear
    2012
  • fDate
    1-4 Oct. 2012
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    FBRAM on UTBOX SOI wafers, using the BJT with a positive back bias programming scheme, is studied versus the gate length. The optimized FBRAM parameters such as the sense margin and the retention time are shown as a function of the gate length. For longer L the back bias can be used to optimize the FBRAM performance, whereas for shorter L, hole generation amplification during the read operation by the bipolar junction transistor gain, inherent to SOI nMOSFET devices and used for the read is a limiting issue. Therefore, there is critical gate length to FBRAM scaling. To avoid FBRAM performance degradation, L should be longer than the critical length. Moreover, this work suggests that vertical devices, which allow longer L are more scalable.
  • Keywords
    MOSFET; bipolar transistors; random-access storage; silicon-on-insulator; BJT; SOI nMOSFET devices; UTBOX FBRAM devices; UTBOX SOI wafers; back bias; bipolar junction transistor gain; floating-body RAM cell; gate length impact; hole generation amplification; optimized FBRAM parameters; positive back bias programming scheme; retention time; sense margin; single transistor 1T-DRAM; Degradation; Junctions; Logic gates; Performance evaluation; Programming; Random access memory; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference (SOI), 2012 IEEE International
  • Conference_Location
    NAPA, CA
  • ISSN
    1078-621X
  • Print_ISBN
    978-1-4673-2690-2
  • Electronic_ISBN
    1078-621X
  • Type

    conf

  • DOI
    10.1109/SOI.2012.6404378
  • Filename
    6404378