DocumentCode
588150
Title
Gate length impact on UTBOX FBRAM devices
Author
Nicoletti, T. ; Santos, S.D. ; Martino, Joao Antonio ; Aoulaiche, Marc ; Veloso, A. ; Jurczak, Malgorzata ; Simoen, Eddy ; Claeys, Cor
Author_Institution
PSI, LSI, Univ. of Sao Paulo, Sao Paulo, Brazil
fYear
2012
fDate
1-4 Oct. 2012
Firstpage
1
Lastpage
2
Abstract
FBRAM on UTBOX SOI wafers, using the BJT with a positive back bias programming scheme, is studied versus the gate length. The optimized FBRAM parameters such as the sense margin and the retention time are shown as a function of the gate length. For longer L the back bias can be used to optimize the FBRAM performance, whereas for shorter L, hole generation amplification during the read operation by the bipolar junction transistor gain, inherent to SOI nMOSFET devices and used for the read is a limiting issue. Therefore, there is critical gate length to FBRAM scaling. To avoid FBRAM performance degradation, L should be longer than the critical length. Moreover, this work suggests that vertical devices, which allow longer L are more scalable.
Keywords
MOSFET; bipolar transistors; random-access storage; silicon-on-insulator; BJT; SOI nMOSFET devices; UTBOX FBRAM devices; UTBOX SOI wafers; back bias; bipolar junction transistor gain; floating-body RAM cell; gate length impact; hole generation amplification; optimized FBRAM parameters; positive back bias programming scheme; retention time; sense margin; single transistor 1T-DRAM; Degradation; Junctions; Logic gates; Performance evaluation; Programming; Random access memory; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
SOI Conference (SOI), 2012 IEEE International
Conference_Location
NAPA, CA
ISSN
1078-621X
Print_ISBN
978-1-4673-2690-2
Electronic_ISBN
1078-621X
Type
conf
DOI
10.1109/SOI.2012.6404378
Filename
6404378
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