Title :
Perspectives on 3D ToF sensor SoC integration for user interface application
Author :
Tae-Yon Lee ; Jung-Kyu Jung ; Dong-Ki Min ; Yoondong Park ; Kwanghyuk Bae ; Tae-Chan Kim
Author_Institution :
Image Lab., Samsung Electron. Co., Ltd., Hwasung, South Korea
Abstract :
System-on-a-chip integration of three dimensional time-of-flight image sensor invokes several technical issues, which are different from the case of conventional two dimensional CMOS image sensor. In this paper, we review several technical issues with examples of several cases, and suggest solutions especially in view point of pixel design.
Keywords :
CMOS image sensors; system-on-chip; three-dimensional integrated circuits; user interfaces; 3D ToF sensor SoC integration; Abstract-System-on-a-chip integration; pixel design view point; technical issues; three dimensional time-of-flight image sensor; two dimensional CMOS image sensor; user interface application; Demodulation; Frequency modulation; Image sensors; Light emitting diodes; Noise; System-on-a-chip; CMOS; image sensor; modulation; pixel; system-on-a-chip; three dimensional; time-of-flight;
Conference_Titel :
SoC Design Conference (ISOCC), 2012 International
Conference_Location :
Jeju Island
Print_ISBN :
978-1-4673-2989-7
Electronic_ISBN :
978-1-4673-2988-0
DOI :
10.1109/ISOCC.2012.6407102
