• DocumentCode
    589512
  • Title

    Top-down and bottom-up approaches to high-density bit-patterned media

  • Author

    Yang, Joel K. W. ; Asbahi, M. ; Thiyagarajah, Naganivetha ; Yunjie Chen ; Siang Huei Leong ; Ng, Vincent

  • Author_Institution
    Inst. of Mater. Res. & Eng., Singapore, Singapore
  • fYear
    2012
  • fDate
    Oct. 31 2012-Nov. 2 2012
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    We develop processes relevant to bit-patterned media (BPM) to achieve nanostructures with densities of up to 4.4 Tdots/in2 using a combination of top-down electron-beam lithography and bottom up self assembly of Au nanoparticles. Evaluation of magnetic bits were performed on purely top-down approaches using both direct-deposition and ion milling processes. Measurements of BPM performance were performed to investigate the effects of trench material, and process conditions.
  • Keywords
    assembling; electron beam lithography; gold; nanoparticles; Au; Au nanoparticles; bottom up selfassembly; high-density bit-patterned media; ion milling process; magnetic bits; top-down electron-beam lithography; trench material; Electronic mail; Gold; Indexes; Magnetic resonance imaging; Nanoparticles; Self-assembly; Silicon; Electron-beam lithography; bit-patterned media; directed self assembly;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    APMRC, 2012 Digest
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4673-4734-1
  • Type

    conf

  • Filename
    6407352
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=589512