DocumentCode :
589512
Title :
Top-down and bottom-up approaches to high-density bit-patterned media
Author :
Yang, Joel K. W. ; Asbahi, M. ; Thiyagarajah, Naganivetha ; Yunjie Chen ; Siang Huei Leong ; Ng, Vincent
Author_Institution :
Inst. of Mater. Res. & Eng., Singapore, Singapore
fYear :
2012
fDate :
Oct. 31 2012-Nov. 2 2012
Firstpage :
1
Lastpage :
2
Abstract :
We develop processes relevant to bit-patterned media (BPM) to achieve nanostructures with densities of up to 4.4 Tdots/in2 using a combination of top-down electron-beam lithography and bottom up self assembly of Au nanoparticles. Evaluation of magnetic bits were performed on purely top-down approaches using both direct-deposition and ion milling processes. Measurements of BPM performance were performed to investigate the effects of trench material, and process conditions.
Keywords :
assembling; electron beam lithography; gold; nanoparticles; Au; Au nanoparticles; bottom up selfassembly; high-density bit-patterned media; ion milling process; magnetic bits; top-down electron-beam lithography; trench material; Electronic mail; Gold; Indexes; Magnetic resonance imaging; Nanoparticles; Self-assembly; Silicon; Electron-beam lithography; bit-patterned media; directed self assembly;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
APMRC, 2012 Digest
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-4734-1
Type :
conf
Filename :
6407352
Link To Document :
بازگشت