DocumentCode :
590400
Title :
Design, fabrication and performance characterizations of an integrated dual-axis tuning fork gyroscope
Author :
Sheng-Ren Chiu ; Chung-Yang Sue ; Chih-Hsiou Lin ; Shih-Ting Lin ; Shih-Chieh Lin ; Yu-Wen Hsu ; Yan-Kuin Su
Author_Institution :
Microsyst. Technol. Center, Ind. Technol. Res. Inst., Tainan, Taiwan
fYear :
2012
fDate :
28-31 Oct. 2012
Firstpage :
1
Lastpage :
4
Abstract :
This paper deals with the design, fabrication and preliminary experimental characterizations of a novel integrated dual-axis tuning fork gyroscope (DTFG). The DTFG is fabricated by high-aspect-ratio silicon-on-glass (SOG) process and vacuum packaged by glass frit bonding. Furthermore, a CMOS drive/readout ASIC chip, which is fabricated by a 0.25 μm 1P5M standard CMOS process, is integrated with the fabricated DTFG by directly wire-bonding. The experimental results of DTFG demonstrate that the rate sensitivities of Z-axis and X-axis sense modes are 1.47 mV/DPS and 0.18 mV/DPS respectively and the associated R2-linearity are 0.9995 and 0.9996. The noise-floors are 0.030 DPS/ Hz1/2 and 0.247 DPS/Hz1/2 for Z-axis and X-axis sense modes respectively.
Keywords :
CMOS integrated circuits; application specific integrated circuits; glass; gyroscopes; integrated circuit bonding; integrated circuit packaging; lead bonding; microfabrication; microsensors; readout electronics; silicon-on-insulator; vibrations; 1P5M standard CMOS process; CMOS drive; DPS; DTFG design; DTFG fabrication; DTFG performance characterisation; Si; SiO2; glass frit bonding; integrated dual axis tuning fork gyroscope; noise floor; readout ASIC chip; silicon-on-glass process; size 0.25 mum; vacuum packaging; voltage 0.18 mV; voltage 1.47 mV; wire bonding; CMOS integrated circuits; Electrodes; Fabrication; Glass; Gyroscopes; Sensitivity; Vibrations;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Sensors, 2012 IEEE
Conference_Location :
Taipei
ISSN :
1930-0395
Print_ISBN :
978-1-4577-1766-6
Electronic_ISBN :
1930-0395
Type :
conf
DOI :
10.1109/ICSENS.2012.6411139
Filename :
6411139
Link To Document :
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