• DocumentCode
    590552
  • Title

    Fabrication and electrical characterization of bottom-up silicon nanowire resonators

  • Author

    Sansa, M. ; Paulo, A.S. ; Perez-Murano, F.

  • Author_Institution
    CNM, IMB, UAB, Bellaterra, Spain
  • fYear
    2012
  • fDate
    28-31 Oct. 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    We present the fabrication and electrical characterization of nanomechanical resonators based on bottom-up grown silicon nanowires. The high piezoresistance coefficients of these nanowires provide an intrinsic transduction mechanism with good performance at high frequencies. We have characterized the frequency response of double clamped silicon nanowires with diameters of less than 100 nm. In particular, we have studied the first and second resonance modes, at frequencies higher than 190 MHz. We have observed the splitting of each resonance mode in two orthogonal vibration modes, which is attributed to the break-down of the axial symmetry of the nanowires. This effect can be used to improve the mass sensing performance of the devices.
  • Keywords
    elemental semiconductors; micromechanical resonators; nanowires; piezoresistance; silicon; Si; bottom-up silicon nanowire resonator fabrication; electrical characterization; high piezoresistance coefficient; intrinsic transduction mechanism; mass sensing; orthogonal vibration mode; resonance mode; Frequency measurement; Frequency modulation; Frequency response; Nanobioscience; Resonant frequency; Sensors; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2012 IEEE
  • Conference_Location
    Taipei
  • ISSN
    1930-0395
  • Print_ISBN
    978-1-4577-1766-6
  • Electronic_ISBN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2012.6411456
  • Filename
    6411456