RFID-based thermal convection accelerometer

This research proposes a wireless RFID-based thermal convection accelerometer, and relates for the technology to manufacture and package it on a flexible substrate, such as polyimide to withstand the temperature (400K) of heater. The key technology is to integrate RFID chip, a wireless RFID antenna, and a thermal convection accelerometer on the same substrate. The heaters and the thermal sensors are made on the flexible substrate with the traditional floating structure. Since the thermal conductivity of the traditional S_i is 1.48 W/(cm-K), it is 25 times of the proposed flexible substrate, i.e. 0.06-0.0017 W/(cm-K), thus the power leakage through the substrate can be saved by the new design. Comparisons are also made by filling the chamber with the traditional carbon dioxide (CO₂) and the proposed xenon (Xe) gases. Note the sensitivity by using CO₂ gas is larger for accelerations lower than 16G, but it saturates beyond this acceleration. While the sensitivity for the new design by using Xe gas is lower, but it saturates at a larger acceleration, i.e. 25G. Note the step-input response times of 25G and 16G with Xe gas are quicker, i.e. 104 and 122μs, respectively.