DocumentCode
59328
Title
Millimeter-Scale True 3-D Antenna-in-Package Structures for Near-Field Power Transfer
Author
Gadfort, P. ; Franzon, Paul D.
Author_Institution
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
Volume
4
Issue
10
fYear
2014
fDate
Oct. 2014
Firstpage
1574
Lastpage
1581
Abstract
This paper describes the modeling, fabrication, and measurement of a method to construct true 3-D antennas for radio frequency (RF) power harvesting in millimeter-scale sensors. The goal is to create an omnidirectional RF power-harvesting structure, which can provide power even if the sensor and external power source are not perfectly aligned. Because the orientation of the sensor is not known in advance, the antenna must work equally well in all directions. To realize such a structure, antennas will be built into the packaging of the sensor, and this allows for the largest possible antenna without increasing the size of the sensor and by combining antennas which are orthogonal to each other. This construction results in a cubic structure, where the power-transfer efficiency can be increased by 22 dB over a traditional single-coil setup at the worst case orientations for the sensor. The presented structures will range from 3 to 5 mm cubes.
Keywords
energy harvesting; inductive power transmission; omnidirectional antennas; planar antenna arrays; system-in-package; millimeter-scale sensors; millimeter-scale true 3D antenna-in-package structures; near field power transfer; omnidirectional antennas; power transfer efficiency; radiofrequency power harvesting; size 3 mm to 5 mm; Antennas; Coils; Couplings; Integrated circuit modeling; Metals; Sensors; Substrates; Coils; electronics packaging; inductive power transmission; omnidirectional antennas; planar arrays; three-dimensional integrated packaging;
fLanguage
English
Journal_Title
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
2156-3950
Type
jour
DOI
10.1109/TCPMT.2014.2349983
Filename
6894138
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