• DocumentCode
    59328
  • Title

    Millimeter-Scale True 3-D Antenna-in-Package Structures for Near-Field Power Transfer

  • Author

    Gadfort, P. ; Franzon, Paul D.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
  • Volume
    4
  • Issue
    10
  • fYear
    2014
  • fDate
    Oct. 2014
  • Firstpage
    1574
  • Lastpage
    1581
  • Abstract
    This paper describes the modeling, fabrication, and measurement of a method to construct true 3-D antennas for radio frequency (RF) power harvesting in millimeter-scale sensors. The goal is to create an omnidirectional RF power-harvesting structure, which can provide power even if the sensor and external power source are not perfectly aligned. Because the orientation of the sensor is not known in advance, the antenna must work equally well in all directions. To realize such a structure, antennas will be built into the packaging of the sensor, and this allows for the largest possible antenna without increasing the size of the sensor and by combining antennas which are orthogonal to each other. This construction results in a cubic structure, where the power-transfer efficiency can be increased by 22 dB over a traditional single-coil setup at the worst case orientations for the sensor. The presented structures will range from 3 to 5 mm cubes.
  • Keywords
    energy harvesting; inductive power transmission; omnidirectional antennas; planar antenna arrays; system-in-package; millimeter-scale sensors; millimeter-scale true 3D antenna-in-package structures; near field power transfer; omnidirectional antennas; power transfer efficiency; radiofrequency power harvesting; size 3 mm to 5 mm; Antennas; Coils; Couplings; Integrated circuit modeling; Metals; Sensors; Substrates; Coils; electronics packaging; inductive power transmission; omnidirectional antennas; planar arrays; three-dimensional integrated packaging;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2014.2349983
  • Filename
    6894138