DocumentCode :
593984
Title :
Process-tolerant Surface Acoustic Wave delay lines
Author :
Malik, Aamir F. ; Burhanudin, Z.A. ; Jeoti, Varun ; Jamali, A.J. ; Hashim, U. ; Foo, K.L.
Author_Institution :
Dept. of Electr. & Electron. Eng., Univ. Teknol. PETRONAS, Tronoh, Malaysia
fYear :
2012
fDate :
11-13 Dec. 2012
Firstpage :
187
Lastpage :
190
Abstract :
Surface Acoustic Wave (SAW) delay lines microfabrication is outlined and its characteristics due to wet chemical etching process variation are investigated. The SAW delay lines consist of Al inter-digital transducers (IDT) on LiNbO3 substrate. It is designed with specific IDT feature size to produce SAW at predetermined central frequency, f0. The effect of the etching process onto the IDT, in particular the feature size, is investigated using field emission secondary electron microscope (FESEM). The effect is then translated into transfer characteristics of the SAW delay lines by measuring its transmission and reflection coefficient using network analyzer. It is found that even with a ~5 μm IDT feature size variation due to the wet chemical etching process, the fabricated delay lines can still produce SAW at the designed f0, and hence a process-tolerant SAW delay lines.
Keywords :
aluminium; etching; lithium compounds; niobium compounds; surface acoustic wave delay lines; Al; FESEM; LiNbO3; field emission secondary electron microscope; interdigital transducer; network analyzer; process-tolerant SAW delay line; reflection coefficient measurement; surface acoustic wave delay line microfabrication; transfer characteristics; transmission measurement; wet chemical etching process variation; Delay lines; Fingers; Frequency measurement; Piezoelectric transducers; Substrates; Surface acoustic waves; Delay Line; IDT; LiNbO3; SAW; Sensor;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Applied Electromagnetics (APACE), 2012 IEEE Asia-Pacific Conference on
Conference_Location :
Melaka
Print_ISBN :
978-1-4673-3114-2
Type :
conf
DOI :
10.1109/APACE.2012.6457657
Filename :
6457657
Link To Document :
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