• DocumentCode
    594064
  • Title

    Waveform relaxation with overlapping based partitioning for fast transient simulation of package/board power distribution networks

  • Author

    Roy, Sandip ; Dounavis, Anestis

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Western Ontario, London, ON, Canada
  • fYear
    2012
  • fDate
    21-24 Oct. 2012
  • Firstpage
    252
  • Lastpage
    255
  • Abstract
    Modeling of power distribution networks in electronic packages requires the two dimensional discretization of the distributed power/ground planes which can be computationally expensive. Recently, the waveform relaxation algorithm has been proposed for fast transient simulation of power/ground planes. However, due to the strong coupling of each node in a two dimensional (2D) physical space, the relaxation iterations exhibit slow convergence and special techniques need to be adopted to ensure efficient convergence. In this work, a novel waveform relaxation algorithm based on physically partitioning the power/ground plane into smaller overlapping subcircuits is presented. The overlap between the subcircuits provides greater exchange of information per iteration leading to accelerated convergence of the waveform relaxation algorithm. A numerical example has been provided to illustrate the validity of the proposed algorithm over full SPICE simulations.
  • Keywords
    circuit simulation; electronics packaging; iterative methods; power electronics; 2D physical space; SPICE simulation; distributed power-ground plane; electronic packageing; fast transient simulation; overlapping subcircuit; overlapping waveform relaxation iteration algorithm; package-board power distribution network; two dimensional discretization; two dimensional physical space; Algorithm design and analysis; Computational modeling; Convergence; Integrated circuit modeling; Partitioning algorithms; SPICE; Transient analysis; Convergence; delay extraction; power distribution networks; signal integrity; transmission lines; waveform relaxation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging and Systems (EPEPS), 2012 IEEE 21st Conference on
  • Conference_Location
    Tempe, AZ
  • Print_ISBN
    978-1-4673-2539-4
  • Electronic_ISBN
    978-1-4673-2537-0
  • Type

    conf

  • DOI
    10.1109/EPEPS.2012.6457889
  • Filename
    6457889